Reactive ion beam etching of aluminum-4% copper thin films and Timothy John Whetten

Text Registration

Reactive ion beam etching of aluminum-4% copper thin films and Timothy John Whetten

Status

Published

on 14 Jun 2007

Year of Creation

1986

Timothy John Whetten

Registration Number

TX0002012505

on 14 Jun 2007

The U.S. Copyright record (Registration Number: TX0002012505) dated 14 Jun 2007, pertains to an electronic file (eService) titled "Reactive ion beam etching of aluminum-4% copper thin films and Timothy John Whetten" created in 1986. The copyright holder is Timothy John Whetten, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to Timothy John Whetten.

Timothy John Whetten

Application Details

Registration Number

TX0002012505

Registration Date

6/14/2007

Year of Creation

1986

Place of First Publication

Ann Arbor

Publisher Name

University Microfilms International

Agency Marc Code

DLC-CO

Record Status

New

Physical Description

microfiche

Personal Authors

Timothy John Whetten

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