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Visit USCOProceedings of ... International Conference on Conduction and Breakdown in Solid Dielectrics sponsored by the I E E E Electrical Insulation Society and the French I E E E Section
Serial Registration
Copyright Title
Proceedings of ... International Conference on Conduction and Breakdown in Solid Dielectrics sponsored by the I E E E Electrical Insulation Society and the French I E E E Section
Status
Published
on 11 Jun 2007
Year of Creation
1983
Copyright Claimant
The Institute of Electrical and Electronics Engineers, Inc
Registration Number
CSN0051072
on 11 Jun 2007Copyright Summary
The U.S. Copyright record (Registration Number: CSN0051072) dated 11 Jun 2007, pertains to an electronic file (eService) titled "Proceedings of ... International Conference on Conduction and Breakdown in Solid Dielectrics sponsored by the I E E E Electrical Insulation Society and the French I E E E Section" created in 1983. The copyright holder is The Institute of Electrical and Electronics Engineers, Inc, known for their creative contributions in serial registration. For any inquiries concerning this copyrighted material, kindly reach out to The Institute of Electrical and Electronics Engineers, Inc.
Application Details
Registration Number
CSN0051072
Registration Date
6/11/2007
Year of Creation
1983
Place of First Publication
[France]
Publisher Name
IEEE
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
International Conference on Conduction and Breakdown in Solid Dielectrics, 1st, Toulouse, France, 1983 Institute of Electrical and Electronics Engineers, Inc. Electrical Insulation Society Institute of Electrical and Electronics Engineers, Inc. French Section Institute of Electrical and Electronics Engineers, Inc
Physical Description
print material
Corporate Authors
Notes
Copyright Local Holdings: no. 1. Held at the Universite Paul Sabatier, Toulouse, France, July 4-8, 1983 Claimant: The Institute of Electrical and Electronics Engineers, Inc Created 1983 Pub. 1983-07-04 Reg. 1983-08-31 TX0001179921 19830704
Statements
Author Statement: The Institute of Electrical and Electronics Engineers, Inc., employer for hire
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