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Visit USCOCopper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics [Published: 2001-05-09. Issue: vol. 2000, no. 27, 2000]
Serial Registration
Copyright Title
Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics [Published: 2001-05-09. Issue: vol. 2000, no. 27, 2000]
Status
Published
on 2 Dec 2008
Year of Creation
2001
Copyright Claimant
The Electrochemical Society, Inc
Registration Number
TX0006911942
on 2 Dec 2008Copyright Summary
The U.S. Copyright record (Registration Number: TX0006911942) dated 2 Dec 2008, pertains to an electronic file (eService) titled "Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics [Published: 2001-05-09. Issue: vol. 2000, no. 27, 2000]" created in 2001. The copyright holder is The Electrochemical Society, Inc, known for their creative contributions in serial registration. For any inquiries concerning this copyrighted material, kindly reach out to The Electrochemical Society, Inc.
Application Details
Registration Number
TX0006911942
Registration Date
12/2/2008
Year of Creation
2001
Agency Marc Code
DLC-CO
Record Status
Changed
Corporate Author
Electrochemical Society, Inc
First Publication Nation
United States
ISBN
1-56677-294-X
Notes
Rights Note: Beth Anne Stuebe, The Electrochemical Society, Inc., 65 S. Main Street, Building D, Pennington, NJ, 08534, United States, (609) 737-1902 x113, bethanne.stuebe@electrochem.org
Copyright Local Holdings: vol. 2000, no. 27, 2000 ISBN 1-56677-294-X Created 2000 Pub. 2001-05-09 Reg. 2008-12-08 TX0006911942 STEK
Statements
Application Title Statement: Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics
Author Statement: The Electrochemical Society, Inc employer for hire Domicile: United States Citizenship: United States Authorship: Collective work which may include text, editing, compilation, and contribution(s) in which copyright has been transferred to the claimant
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