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Visit USCOProceedings of the First International Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications edited by Ulrich Goesele, Jan Haisma, Takano Abe, Martin A. Schmidt
Text Registration
Copyright Title
Proceedings of the First International Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications edited by Ulrich Goesele, Jan Haisma, Takano Abe, Martin A. Schmidt
Status
Published
on 14 Jun 2007
Year of Creation
1992
Copyright Claimant
the Electrochemical Society, Inc. (employer for hire)
Registration Number
TX0003306878
on 14 Jun 2007Copyright Summary
The U.S. Copyright record (Registration Number: TX0003306878) dated 14 Jun 2007, pertains to an electronic file (eService) titled "Proceedings of the First International Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications edited by Ulrich Goesele, Jan Haisma, Takano Abe, Martin A. Schmidt" created in 1992. The copyright holder is The Electrochemical Society, Inc. (employer for hire), known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to The Electrochemical Society, Inc. (employer for hire).
Application Details
Registration Number
TX0003306878
Registration Date
6/14/2007
Year of Creation
1992
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
Electrochemical Society, Inc International Symposium on Semiconductor Wafer Bonding : Science, Technology, and Applications, 1st, Phoenix, 1991
Series Statement
Proceedings vol. 92-7
Corporate Authors
Notes
Bibliographic Note: Symposia held Oct. 13-18, 1991, in Phoenix
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