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A study on the reliability of flip chip solder joints
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Copyright Title

A study on the reliability of flip chip solder joints

Status

Published

on 14 Jun 2007
Year of Creation
2000
Copyright Claimant
Peng Su
Registration Number
TX0005325732
on 14 Jun 2007

Copyright Summary


The U.S. Copyright record (Registration Number: TX0005325732) dated 14 Jun 2007, pertains to an electronic file (eService) titled "A study on the reliability of flip chip solder joints" created in 2000. The copyright holder is Peng Su, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to Peng Su.

Copyright Details


Copyright Claimant
Peng Su

Application Details


Registration Number
TX0005325732
Registration Date
6/14/2007
Year of Creation
2000
Agency Marc Code
DLC-CO
Record Status
New
Physical Description
Computer text data

Personal Authors


Notes


Rights Note: Rights and permissions info. on CORDS appl. in CO
Bibliographic Note: Electronic registration

Statements


Author Statement: entire text: Peng Su
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