JEDEC publication constant temperature aging to characterize aluminum interconnect metallization : for stress-induced voiding : JEP139

Text Registration

JEDEC publication constant temperature aging to characterize aluminum interconnect metallization : for stress-induced voiding : JEP139

Status

Published

on 14 Jun 2007

Year of Creation

2000

JEDEC

Registration Number

TX0005433835

on 14 Jun 2007

The U.S. Copyright record (Registration Number: TX0005433835) dated 14 Jun 2007, pertains to an electronic file (eService) titled "JEDEC publication constant temperature aging to characterize aluminum interconnect metallization : for stress-induced voiding : JEP139" created in 2000. The copyright holder is JEDEC, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to JEDEC.

JEDEC

Application Details

Registration Number

TX0005433835

Registration Date

6/14/2007

Year of Creation

2000

Agency Marc Code

DLC-CO

Record Status

New

Corporate Author

JEDEC

Physical Description

12 p

Corporate Authors

JEDEC

Statements

Application Title Statement: JEP139: constant temperature aging to characterize aluminum interconnect metallization for stress-induced voiding

Statements

Application Title Statement: JEP139: constant temperature aging to characterize aluminum interconnect metallization for stress-induced voiding

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