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Qualification and performance specification for organic multichip module (MCM-L) mounting and interconnecting structures IPC-6015 : a standard developed by the Institute for Interconnecting and Packaging Electronic Equipment
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Copyright Title

Qualification and performance specification for organic multichip module (MCM-L) mounting and interconnecting structures IPC-6015 : a standard developed by the Institute for Interconnecting and Packaging Electronic Equipment

Status

Published

on 14 Jun 2007
Year of Creation
1998
Registration Number
TX0004963086
on 14 Jun 2007

Copyright Summary


The U.S. Copyright record (Registration Number: TX0004963086) dated 14 Jun 2007, pertains to an electronic file (eService) titled "Qualification and performance specification for organic multichip module (MCM-L) mounting and interconnecting structures IPC-6015 : a standard developed by the Institute for Interconnecting and Packaging Electronic Equipment" created in 1998. The copyright holder is IPC--Association Connecting Electronics Industry (employer for hire), known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to IPC--Association Connecting Electronics Industry (employer for hire).

Application Details


Registration Number
TX0004963086
Registration Date
6/14/2007
Year of Creation
1998
Place of First Publication
Northbrook, IL
Publisher Name
IPC
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
Institute for Interconnecting and Packaging Electronic Equipment IPC--Association Connecting Electronics Industry
Physical Description
1 v
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