IPC-J-STD-030 guideline for selection and application of underfill material for flip chip and other micropackages

Text Registration

IPC-J-STD-030 guideline for selection and application of underfill material for flip chip and other micropackages

Status

Published

on 15 Jun 2007

Year of Creation

2005

IPC (Association Connecting Electronics Industries)

Registration Number

TX0006380453

on 15 Jun 2007

The U.S. Copyright record (Registration Number: TX0006380453) dated 15 Jun 2007, pertains to an electronic file (eService) titled "IPC-J-STD-030 guideline for selection and application of underfill material for flip chip and other micropackages" created in 2005. The copyright holder is IPC (Association Connecting Electronics Industries), known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to IPC (Association Connecting Electronics Industries).

IPC (Association Connecting Electronics Industries)

Application Details

Registration Number

TX0006380453

Registration Date

6/15/2007

Year of Creation

2005

Agency Marc Code

DLC-CO

Record Status

Changed

Corporate Author

IPC Association Connecting Electronics Industries

Corporate Authors

IPC

Association Connecting Electronics Industries

Notes

Local Copyright Note: Cataloged from appl. only

Notes

Local Copyright Note: Cataloged from appl. only

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