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2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (09EX2822)
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2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (09EX2822)

Status

Published

on 1 Jun 2009
Year of Creation
2009
Copyright Claimant
IEEE
Registration Number
TX0007211400
on 1 Jun 2009

Copyright Summary


The U.S. Copyright record (Registration Number: TX0007211400) dated 1 Jun 2009, pertains to an electronic file (eService) titled "2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (09EX2822)" created in 2009. The copyright holder is IEEE, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to IEEE.

Copyright Details


Copyright Claimant
IEEE

Application Details


Registration Number
TX0007211400
Registration Date
6/1/2009
Year of Creation
2009
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
IEEE
Physical Description
CD-ROM
First Publication Nation
United States

Corporate Authors


Notes


Rights Note: William J. Hagen, (732) 562-3966, (732) 562-3973, w.hagen@ieee.org
Local Copyright Note: C.O. correspondence

Statements


Application Title Statement: 2009 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (09EX2822)
Author Statement: IEEE employer for hire Domicile: United States Citizenship: United States Authorship: collective work
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