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Visit USCOCopper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics
Text Registration
Copyright Title
Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics
Status
Published
on 14 Jun 2007
Year of Creation
2001
Copyright Claimant
Electrochemical Society, Inc
Registration Number
TX0005717268
on 14 Jun 2007Copyright Summary
The U.S. Copyright record (Registration Number: TX0005717268) dated 14 Jun 2007, pertains to an electronic file (eService) titled "Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics" created in 2001. The copyright holder is Electrochemical Society, Inc, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to Electrochemical Society, Inc.
Application Details
Registration Number
TX0005717268
Registration Date
6/14/2007
Year of Creation
2001
Place of First Publication
Pennington, NJ
Publisher Name
Electrochemical Society
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
Electrochemical Society, Inc
Physical Description
224 p
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