Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II Proceedings of the international symposium editor, G. S. Mathad, assistant editors, V. Bakshi, H. S. Rathore ... [et al.]

Text Registration

Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II Proceedings of the international symposium editor, G. S. Mathad, assistant editors, V. Bakshi, H. S. Rathore ... [et al.]

Status

Published

on 15 Jun 2007

Year of Creation

2003

Electrochemical Society, Inc. (employer for hire)

Registration Number

TX0005976150

on 15 Jun 2007

The U.S. Copyright record (Registration Number: TX0005976150) dated 15 Jun 2007, pertains to an electronic file (eService) titled "Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II Proceedings of the international symposium editor, G. S. Mathad, assistant editors, V. Bakshi, H. S. Rathore ... [et al.]" created in 2003. The copyright holder is Electrochemical Society, Inc. (employer for hire), known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to Electrochemical Society, Inc. (employer for hire).

Electrochemical Society, Inc. (employer for hire)

Application Details

Registration Number

TX0005976150

Registration Date

6/15/2007

Year of Creation

2003

Place of First Publication

Pennington, NJ

Publisher Name

Electrochemical Society

Agency Marc Code

DLC-CO

Record Status

New

Corporate Author

Electrochemical Society, Inc

Physical Description

276 p

Series Statement

Proceedings vol. 2003-10

Personal Authors

G. S Mathad

V Bakshi

H. S Rathore

Corporate Authors

Inc Electrochemical Society

Statements

Application Title Statement: Copper interconnects, low k interlevel dielectrics and new contact metallurgies/structures

Statements

Application Title Statement: Copper interconnects, low k interlevel dielectrics and new contact metallurgies/structures

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