HomeOwner SearchCategory Search
Continuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging
Visit USCO
hero image
Text Registration
Copyright Title

Continuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging

Status

Published

on 1 May 2008
Year of Creation
2007
Copyright Claimant
David Michael Pierce
Registration Number
TX0006623095
on 1 May 2008

Copyright Summary


The U.S. Copyright record (Registration Number: TX0006623095) dated 1 May 2008, pertains to an electronic file (eService) titled "Continuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging" created in 2007. The copyright holder is David Michael Pierce, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to David Michael Pierce.

Copyright Details


Copyright Claimant
David Michael Pierce

Application Details


Registration Number
TX0006623095
Registration Date
5/1/2008
Year of Creation
2007
Agency Marc Code
DLC-CO
Record Status
New
Physical Description
Computer text data

Personal Authors


Notes


Rights Note: Rights and permissions info. on CORDS appl. in CO
Local Copyright Note: Electronic registration

Statements


Author Statement: entire text: David Michael Pierce
Get your copyright registered todayThousands have copyrighted their assets.
What are you waiting for?

© 2024 reserved by Trademarkia
Show terms & conditions