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Visit USCOContinuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging
Text Registration
Copyright Title
Continuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging
Status
Published
on 1 May 2008
Year of Creation
2007
Copyright Claimant
David Michael Pierce
Registration Number
TX0006623095
on 1 May 2008Copyright Summary
The U.S. Copyright record (Registration Number: TX0006623095) dated 1 May 2008, pertains to an electronic file (eService) titled "Continuum damage mechanics based failure prediction methodology for tin-silver-copper solder alloy interconnects in electronic packaging" created in 2007. The copyright holder is David Michael Pierce, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to David Michael Pierce.
Application Details
Registration Number
TX0006623095
Registration Date
5/1/2008
Year of Creation
2007
Agency Marc Code
DLC-CO
Record Status
New
Physical Description
Computer text data
Notes
Rights Note: Rights and permissions info. on CORDS appl. in CO
Local Copyright Note: Electronic registration
Statements
Author Statement: entire text: David Michael Pierce
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