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Visit USCOElectronic packaging materials and processes : proceedings of A S M's 2nd Electronic Packaging : Materials and Processes Conference, Bloomington, Minnesota, 29-31 October 1985, also includes selected papers from the 1st Electronic Packaging Conference, St. Paul, Minnesota, 21-23 August 1984 edited by J. A. Sartell ; sponsored by A S M's Electronic Materials and Processing Division
Text Registration
Copyright Title
Electronic packaging materials and processes : proceedings of A S M's 2nd Electronic Packaging : Materials and Processes Conference, Bloomington, Minnesota, 29-31 October 1985, also includes selected papers from the 1st Electronic Packaging Conference, St. Paul, Minnesota, 21-23 August 1984 edited by J. A. Sartell ; sponsored by A S M's Electronic Materials and Processing Division
Status
Published
on 14 Jun 2007
Year of Creation
1986
Copyright Claimant
American Society for Metals
Registration Number
TX0001836174
on 14 Jun 2007Copyright Summary
The U.S. Copyright record (Registration Number: TX0001836174) dated 14 Jun 2007, pertains to an electronic file (eService) titled "Electronic packaging materials and processes : proceedings of A S M's 2nd Electronic Packaging : Materials and Processes Conference, Bloomington, Minnesota, 29-31 October 1985, also includes selected papers from the 1st Electronic Packaging Conference, St. Paul, Minnesota, 21-23 August 1984 edited by J. A. Sartell ; sponsored by A S M's Electronic Materials and Processing Division" created in 1986. The copyright holder is American Society for Metals, known for their creative contributions in text registration. For any inquiries concerning this copyrighted material, kindly reach out to American Society for Metals.
Application Details
Registration Number
TX0001836174
Registration Date
6/14/2007
Year of Creation
1986
Place of First Publication
[S.l.]
Publisher Name
ASM
Agency Marc Code
DLC-CO
Record Status
New
Corporate Author
American Society for Metals American Society for Metals. Electronic Materials and Processing Division Electronic Packaging : Materials and Processes Conference, 2nd, Bloomington, Minn., 1985 Electronic Packaging Conference, 1st, Saint Paul, 1984
Physical Description
138 p
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